Pubblicazioni
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Dr. Markus Kogel-Hollacher is presenting a paper at this year´s Photonics West
Precitec Optronik Head of R&D and Photonics 100 honouree Dr. Markus Kogel-Hollacher is presenting a paper at this year's Photonics West.
He talked…
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Perché i processi laser svolgono un ruolo così importante nello sviluppo della mobilità elettrica?
La fotonica, in particolare laser e sensori, è pronta ad assumere un ruolo significativo nel mercato delle batterie nei prossimi anni. L’evoluzione…
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Challenges Wire Bond Inspection
The article from Semi Engineering explores challenges in the wire bonding industry as seen by key players in the markets. Interesting insights and…
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And the Prism Award 2023 goes to..
Precitec 3D Metrology wins prestigious Prism Award 2023.
SPIE, the international society for optics and photonics, honored the Flying Spot Scanner…
![[Translate to Italienisch:] Enovasense sensor at work](/fileadmin/News/Enovasense_Sensor_1920x1280.jpg)
Precitec Acquires Majority Stake in Enovasense Thickness Sensor Company
Precitec Optronik has acquired a majority stake in the French start-up Enovasense with its technology to measure the thickness of all kinds of…
![[Translate to Italienisch:] Nominees for Test and Measurement category](/fileadmin/News/Prism_Award_2023_1920x1280.jpg)
Precitec 3D Metrology è stata nominata per il premio SPIE Prism Award
SPIE announces finalists for 2023 Prism Awards
The annual awards celebrate the best of photonics innovation in areas such as biomedical devices,…
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Hand in hand for customised solutions
Article in Glass WorldWide April 2021
Precitec’s optical measuring technology is used throughout manufacturing industry for quality inspection and…
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Non-contact thickness measurement of non-transparent components
Publication in the German Magazine InVision in April 2020
With the CHRocodile 2 DPS dual-channel sensor Precitec Optronik offers a stand-alone…
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In-Process Wafer Step Height Measurement
Non-contact and non-destructive optical measuring in the nanometer range
During the grinding process the wafer thickness needs to be controlled in…